• Introduction to Semicondcutors Packaging (Spring 2024-Present)
• Physical Inspection and Attacks on Electronics (PHIKS) (Fall 2018-Present)
  • In this course I first introduce the basic principles for different imaging/probing (optical, SEM, X-ray, FIB, PEM, EOFM, EOP, nanoprobing, etc. as shown in the image below) and image analysis (segmentation, filtering, etc.) techniques and then we use them for failure analysis, and hardware assurance including reverse engineering, Trojan detection, counterfeit detection, etc.
  • Lectures1, Lecture 2, Lecture 3, Lecture 4, Lecture 5, Lecture 6, Lecture 7, Lecture 8, Lecture 9, Lecture 10, Lecture 11, Lecture 12, Lecture 13, Lecture 14, Lecture 15, Lecture 16, Lecture 17, Lecture 18, Lecture 19, Lecture 20, Lecture 21  

• Electrical Engineering Department (University of Florida)

              EEL-3112, Circuits II, (Spring 2018-2020)

• Electrical Engineering Department (University of Connecticut)

              ECE-4902, Electrical and Computer Engineering Design II, (Spring 2015)

• Mechanical Engineering Department (University of Connecticut)

            Lab instructor:

            ME-3264, Applied Measurements Laboratory, (Spring 2013 and 2014)

           Teaching Assistant:

             ME-3227,Design of Machine Elements, (Fall 2013)

             ME-5420,Advanced Vibration, Graduate level course, (Fall 2012)

             ME-3225,Computer-Aided Engineering Design, (Fall 2010)