Invited Talks

Invited Talks

  • Intel, December 2019, The role of physical inspection in hardware assurance.
  • MTVCON, December 2019, Backside Security Assessment of ICs
  • ITC, November 2019, Is Backside the New Backdoor in Modern SoCs
  • ITC-Sky talk, November 2019 , Holistic approach for PCB assurance, (first place selected by Venture Capitals committee).
  • Air Force Research Laboratory AFRL, October, 2019, Physical Inspection and assurance.
  • Edpative Computing Inc., October, 2019, Automated Bill of Material.
  • Lockheed Martin, September 2019, Knowledge guided approach for PCB Assurance.
  • Physical Assurance and INspection on Electronics (PAINE), July 2019,  A New Framework for Automated Bill of Material Extraction for PCB Assurance.
  • Cisco Research Center, December, 2018, A Basic Framework for PCB Reverse Engineering, Analysis and Defect Diagnosis.
  • IEEE 3rd International Verification and Security Workshop (IVSW), July 2018, Physical Inspection & Attacks: New Frontier in Hardware Security. 
  • International Conference on Communication, Imaging and Signal Processing (CCISP), Dubai, November 2016, Counterfeit Electronics Detection Using Image Processing and Machine Learning.
  • Society of Photographic Instrumentation Engineers (SPIE), August 2015, A review on THz characterization of electronic components and a comparison of THz imaging characterization with other techniques.