Google, May 2025, AI for Inspection in Advanced Electronics System and Components
SEMIEXPO, March 2025, Addressing the Automation and Workforce Needs in Advanced Packaging
NHanced, March 2025, Challenges of Inspection in Hybrid Bonding
NSF, March 2025, Next Generation low Noise X-ray Imaging
FSI Summit, February 2025, Introduction to Advanced Packaging
HIR February 2025, Hardware Security Chapter
NYU AbuDhabi, December 2024, An Overview on Electronics Inspection
KEYNOTE SPACE India, December 2024, The Role of Physical in Microelectronics Assurance
iSES India, December 2024, Advanced Packaging X-ray Analysis
AFRL Eglin, December 2024, Multi-modal Analysis for Assurance
ESREF, September 2024, Hardware Security Meets Failure Analysis
NAVAIR, June 2024, Security of Printed Circuit Boards
AIM Photonics, July 2024, Role of Physical Assurance in Advanced Packaging
University of Binghamton, June 2024, Physical Assurance for Advanced Packaging
NVIDIA Silicon Engineering Team, February 2024, Optical Probing for Assurance
iNEMI Tech Topic Series, December 2023, Understanding Counterfeit Detection and Mitigation
Arizona State University, November 2023, New Trends for Advanced Packaging Assurance
KEYNOTE ACM ISCA – HipChips, Orlando, June 2023, Assurance from Chiplets to Systems
DRAPER GBC Tech Talk, May 2023, Packaging Assurance and Inspection
KEYNOTE ACM ISCA – HipChips, Orlando, June 2023, Assurance from Chiplets to Systems
DRAPER GBC Tech Talk, May 2023, Packaging Assurance and Inspection
KEYNOTECAM Conference,Halle – Germany, April 2023, Physical Assurance for Advanced Packaging
Intel, April 2023, Advanced Packaging and Heterogeneous Integration Assurance
Applied Materials, March 2023, An Overview to Advanced Packaging Assurance
Meta, February 2023, Physical Assurance of Datacenters
NIST, January 2023, Multi Modal Probing Techniques for Assurance.
NIST Industrial Advisory Committee,January 2023, Future of workforce for CHIPS Act.
Invariant Corp., January 2023, Workforce development for advanced packaging
Raytheon, November 2022, FA for Assurance
Nanyang Technical University, July 2022, Lessons learned on Physical Assurance for Electronics.
IEEE IPFA Conference, July 2022, Electronics Physical Assurance, Challenges and Opportunities
EDFAS Lonestar Chapter’s Series, September 2021, Physical Assurance for Electronics.
Virtual Workshop on Machine Learning & Hardware Security, September 2021, Machine Leanring for Physical Assurance
GLC, August 2021, Security of Interposers
IEEE MDTS, May 2021, Physical Assurance for Package Security
IEEE Oregon Computer Society webinar, April 2021, Role of Physical Assurance in Electronics
KEYNOTE CMSE conference, April 2021, Physical assurance for Military and Space Electronics
MEPTEC, April 2021, Physical Assurance for Microelectronics
Material Science Department, University of Florida, March 2021, Materials for Hardware Security
Facebook, March 2021, Pro and Cons of Physical Assurance for Electronics
KSMC, March 2021, Fingerprinting for Physical Assurance
Navy, March 2021, Advanced X-ray Reconstruction for PCB Assurance
Riscure Webinar Series, March 2021, Optical Probing Attacks
MEST Webinar Series, March 2021, Contactless Attacks on Chip Backside
Synopsys, February 2021, X-ray Image Reconstruction and Segmentation for PCB Assurance
IEEE Asian ITC, September 2020, Emerging Attacks on Microelectronics
IEEE VTS, April 2020, Novel Attacks on Logic Locking
AvMc, February 2020, Optical Probing for Security
Intel, December 2019, The role of physical inspection in hardware assurance.
MTVCON, December 2019, Backside Security Assessment of ICs
ITC, November 2019, Is Backside the New Backdoor in Modern SoCs
ITC-Sky talk, November 2019 , Holistic approach for PCB assurance, (first place selected by Venture Capitals committee).
Air Force Research Laboratory AFRL, October, 2019, Physical Inspection and assurance.
EdpativeComputing Inc., October, 2019, Automated Bill of Material.
Lockheed Martin, September 2019, Knowledge guided approach for PCB Assurance.
Physical Assurance and INspection on Electronics (PAINE), July 2019, A New Framework for Automated Bill of Material Extraction for PCB Assurance.
Cisco Research Center, December, 2018, A Basic Framework for PCB Reverse Engineering, Analysis and Defect Diagnosis.
IEEE 3rd International Verification and Security Workshop (IVSW), July 2018, Physical Inspection & Attacks: New Frontier in Hardware Security.
International Conference on Communication, Imaging and Signal Processing (CCISP), Dubai, November 2016, Counterfeit Electronics Detection Using Image Processing and Machine Learning.
Society of Photographic Instrumentation Engineers (SPIE), August 2015, A review on THz characterization of electronic components and a comparison of THz imaging characterization with other techniques.
