Invited Talks
- KEYNOTE ACM ISCA – HipChips, Orlando, June 2023, Assurance from Chiplets to Systems
- DRAPER GBC Tech Talk, May 2023, Packaging Assurance and Inspection
- KEYNOTE CAM Conference, Halle – Germany, April 2023, Physical Assurance for Advanced Packaging
- Intel, April 2023, Advanced Packaging and Heterogeneous Integration Assurance
- Applied Materials, March 2023, An Overview to Advanced Packaging Assurance
- Meta, February 2023, Physical Assurance of Datacenters
- NIST, January 2023, Multi Modal Probing Techniques for Assurance.
- NIST Industrial Advisory Committee, January 2023, Future of workforce for CHIPS Act.
- Invariant Corp., January 2023, Workforce development for advanced packaging
- Raytheon, November 2022, FA for Assurance
- Nanyang Technical University, July 2022, Lessons learned on Physical Assurance for Electronics.
- IEEE IPFA Conference, July 2022, Electronics Physical Assurance, Challenges and Opportunities
- EDFAS Lonestar Chapter’s Series, September 2021, Physical Assurance for Electronics.
- Virtual Workshop on Machine Learning & Hardware Security, September 2021, Machine Leanring for Physical Assurance
- GLC, August 2021, Security of Interposers
- IEEE MDTS, May 2021, Physical Assurance for Package Security
- IEEE Oregon Computer Society webinar, April 2021, Role of Physical Assurance in Electronics
- KEYNOTE CMSE conference, April 2021, Physical assurance for Military and Space Electronics
- MEPTEC, April 2021, Physical Assurance for Microelectronics
- Material Science Department, University of Florida, March 2021, Materials for Hardware Security
- Facebook, March 2021, Pro and Cons of Physical Assurance for Electronics
- KSMC, March 2021, Fingerprinting for Physical Assurance
- Navy, March 2021, Advanced X-ray Reconstruction for PCB Assurance
- Riscure Webinar Series, March 2021, Optical Probing Attacks
- MEST Webinar Series, March 2021, Contactless Attacks on Chip Backside
- Synopsys, February 2021, X-ray Image Reconstruction and Segmentation for PCB Assurance
- IEEE Asian ITC, September 2020, Emerging Attacks on Microelectronics
- IEEE VTS, April 2020, Novel Attacks on Logic Locking
- AvMc, February 2020, Optical Probing for Security
- Intel, December 2019, The role of physical inspection in hardware assurance.
- MTVCON, December 2019, Backside Security Assessment of ICs
- ITC, November 2019, Is Backside the New Backdoor in Modern SoCs
- ITC-Sky talk, November 2019 , Holistic approach for PCB assurance, (first place selected by Venture Capitals committee).
- Air Force Research Laboratory AFRL, October, 2019, Physical Inspection and assurance.
- Edpative Computing Inc., October, 2019, Automated Bill of Material.
- Lockheed Martin, September 2019, Knowledge guided approach for PCB Assurance.
- Physical Assurance and INspection on Electronics (PAINE), July 2019, A New Framework for Automated Bill of Material Extraction for PCB Assurance.
- Cisco Research Center, December, 2018, A Basic Framework for PCB Reverse Engineering, Analysis and Defect Diagnosis.
- IEEE 3rd International Verification and Security Workshop (IVSW), July 2018, Physical Inspection & Attacks: New Frontier in Hardware Security.
- International Conference on Communication, Imaging and Signal Processing (CCISP), Dubai, November 2016, Counterfeit Electronics Detection Using Image Processing and Machine Learning.
- Society of Photographic Instrumentation Engineers (SPIE), August 2015, A review on THz characterization of electronic components and a comparison of THz imaging characterization with other techniques.