Publications

Publications

Books

  • N. Asadizanjani, M. Tanjidur Rahman, M. Tehranipoor,  Physical Assurance for Electronic Devices and Systems, Springer, (November 2020).

Book Chapter

  • N. Asadizanjani, Counterfeit Integrated Circuits: Detection and Avoidance, Springer, 2015, chapters 3 and 7.
  • B. Shakya, X. Xu, N. Asadizanjani, M. Tehranipoor, D. Forte, “Leveraging Circuit Edit for Low-Volume Trusted Nanometer Fabrication”, in Security Opportunities in Nano Devices and Emerging Technologies by Mark M. Tehranipoor, Domenic Forte, Garrett Rose, and Swarup Bhunia, CRC Press, 2017.

Journal Publications

  • M.A.M. Sathiaseelan, O.P. Paradis, S. Taheri, and N. Asadizanjani, “Why Is Deep Learning Challenging for Printed Circuit Board (PCB) Component Recognition and How Can We Address It?”, Cryptography 2021, 5, 9.
  • D. Mehta, H. Lu, O. Paradis, M. Azhagan, Y. Iskander, P. Chawla, D. L. Woodard, M. Tehranipoor, and N. Asadizanjani, “The Big Hack Explained: Detection and Prevention of PCB Supply Chain Implants”, ACM Journal on Emerging Technologies in Computing Systems (JETC), vol. 14 no. 4, pg. 1 – 42, 2020
  • M. T. Rahman, N. F. Dipu, D. Mehta, S. Tajik, Ma. Tehranipoor, and N. Asadizanjani “CONCEALING-Gate: Contactless Optical Probing Resilient Design” to appear on Journal on Emerging Technologies in Computing Systems (JETC), 2020. 
  • N. Jessurun, O. P. Paradis, A. Roberts, N. Asadizanjani, Component Detection and Evaluation Framework (CDEF): A Semantic Annotation Tool, Microscopy and Microanalysis, 1-5, 2020.
  • N. Varshney, H. Shen, O. P. Paradis, N. Asadizanjani, (2020). He-ion Beam Imaging for Accurate Hardware Trojan Detection. Microscopy and Microanalysis, 1-3, 2020.
  • K. Ahi, N. Jessurun, M. Hosseini, N. Asadizanjani, “Survey of terahertz photonics and biophotonics”, Optical Engineering, 59 (6), pages 1-32, 2020.
  • T. Rahman , M. S. Rahman, H. Wang, S. Tajik, W. Khalil, F. Farahmandi, D. Forte, N. Asadizanjani, M. Tehranipoor, “Defense-in-depth: a recipe for logic locking to prevail”, Integration, Januray 2020.
  • M. Rahman, N. Asadizanjani, “Failure Analysis For Hardware Assurance and Security”, Electronic Device Failure Analysis (EDFA), August 2019. 
  • R. Wilson, N. Asadizanjani, D. Forte, D.Woodard, “First Auto-Magnifier Platform for Hardware Assurance and Reverse Engineering Integrated Circuits” Microscopy and Microanalysis, 25(S2), 226-227, 2019. 
  • F. Ganji, D. Forte, N. Asadizanjani, M. Tehranipoor, D. Woodard, “The power of IC Reverse Engineering for Hardware Trust and Assurance”, Electronic Device Failure Analysis (EDFA), May 2019. 
  • N. Vashistha, M Tanjidur Rahman, H. Shen, D. L. Woodard, N. Asadizanjani, and M. Tehranipoor. Detecting hardware Trojans inserted by untrusted foundry using physical inspection and advanced image processing. Journal of Hardware and Systems Security (HaSS), pages 1–12, 2018.
  • E.L. Principe, N. Asadizanjani, D. Forte, M. Tehranipoor, R. Chivas, M. DiBattista, S. Silverman, “Plasma FIB Deprocessing of Integrated Circuits from the Backside”, Electronic Device Failure Analysis (EDFA), Vol. 19, No. 4, November 2017. 
  • K. Ahi, S. Shahbazmohamadi, and N. Asadizanjani, “Quality control and authentication of packaged integrated circuits using enhanced-spatial-resolution terahertz time-domain spectroscopy and imaging“, Optics and Lasers in Engineering, 2017.
  • N. Asadizanjani, M. Tehranipoor, D. Forte, “Counterfeit Electronics Detection Using Image Processing and Machine Learning”, Journal of Physics: Conference Series. Vol. 787. No. 1. IOP Publishing, 2017.
  • M. Alam, N. Asadizanjani, M. Tehranipoor, D. Forte, “Impact of X-ray Tomography on the Reliability of Integrated Circuits”, IEEE Transactions on Device and Materials Reliability (TDMR), 17(1), pp.59-68, 2017.
  • N. Asadizanjani, M. Tehranipoor, D. Forte, “PCB Reverse Engineering Using Non-destructive X-ray Tomography and Advanced Image Processing”, Transactions on Components, Packaging and Manufacturing Technology (TCPMT), 7(2), pp.292-299, 2017.
  • N. Asadizanjani, S. Shahbazmohamadi , E.H. Jordan, “Optimization and development of X-ray Microscopy Technique for investigation of Thermal Barrier Coating”, Processing and Properties of Advanced Ceramics and Composites VII: Ceramic Transactions, Vol. 252, pp. 425-440, 2015.
  • S. E. Quadir, J.Chen, D.Forte, N. Asadizanjani, S. Shahbazmohamadi, L. Wang, J. Chandy, M. Tehranipoor, “A survey on chip to system reverse engineering” ACM journal on emerging technologies in computing systems (JETC), 13(1), p.6., 2015.
  • N. Asadizanjani, S. Shahbazmohamadi, E.H. Jordan, “Investigation of Surface Geometry Change in Thermal Barrier Coatings Using Computed X-ray Tomography”, Developments in Strategic Materials and Computational Design V: Ceramic Engineering and Science Proceedings, Volume 358, 2015.
  • S. Zanganeh, S. Zanganeh, Rajabi, M. Allahkarami, R.G. Ghahnavyeh, A. Moghaddas, M. Aieneravaie, N. Asadizanjani, and S.K. Sadrnezhaad. “Flower-like boehmite nanostructure formation in two-steps.”Journal of Coordination Chemistry, Vol. 67, No. 3 pp. 555-562, 2014.
  • N. Asadizanjani, Z. Fan, R.X. Gao, and D.O. Kazmer, “Acoustic Wave-Based Data Transmission for Multivariate Sensing.” IEEE Transactions on Instrumentation and Measurement, Vol. 62, No. 11, pp. 3026-3034, 2013.
  • N. Asadizanjani, R.X. Gao, Z. Fan, and D.O. Kazmer, “Acoustic-based wireless signal transmission for precision metrology: Accuracy and reliability.”CIRP Annals-Manufacturing Technology Vol. 62, No. 1, pp. 519-522, 2013.

Peer Reviewed Conference papers

  • O. P. Paradis, D. E. Capecci, N. T. Jessurun, D. L. Woodard, M. Tehranipoor, N. Asadizanjani, “Framework for Automatic PCB Marking Detection and Recognition for Hardware Assurance”, GOMACtech, March 2021.
  • U. Botero, F. Ganji, N. Asadizanjani, D.Woodard, D. Forte, “Semi-Supervised Automated Layer Identification of X-ray Tomography Imaged PCBs”, IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), December 2020.
  • N. Jessurun, O. P. Paradis, M. Tehranipoor, and N. Asadizanjani “SHADE: Automated Refinement of PCB Component Estimates Using Detected Shadows”, IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), December 2020. (Best student presentation award)
  • M.T. Rahman, S. Tajik, M.S. Rahman, M. Tehranipoor, and N. Asadizanjani “The Key is Left under the Mat: On the Inappropriate Security Assumption of Logic Locking Schemes”, IEEE International Symposium on Hardware-Oriented Security and Trust (HOST), December 2020.
  • H. Lu, R. Wilson, N. Vashistha, N. Asadizanjani, M. Tehranipoor, and D. Woodard, “Knowledge-based Object Localization in Scanning Electron Microscopy Images for Hardware Assurance”, International Symposium for Testing and Failure Analysis (ISTFA), November 2020.
  • A. Roberts, J. True, N. Jessurun and N. Asadizanjani, “An Overview of 3D X-ray Reconstruction Algorithms for PCB Inspection”, International Symposium for Testing and Failure Analysis (ISTFA), November 2020.
  • O. P. Paradis, N. Jessurun, M. Tehranipoor, and N. Asadizanjani, “Color Normalization for Robust Automatic Bill of Materials Generation and Visual Inspection of PCBs”, International Symposium for Testing and Failure Analysis (ISTFA), November 2020.
  • UJ Botero, D. Koblah, DE Capecci, F. Ganji, N. Asadizanjani, DL Woodard, D. Forte, “Automated Via Detection for PCB Reverse Engineering”, International Symposium for Testing and Failure Analysis (ISTFA), November 2020. (Outstanding Paper Award)
  • R. Wilson, D. Forte, N. Asadizanjani, D. Woodard, “LASRE: A Novel Approach to Large area Accelerated Segmentation for Reverse Engineering on SEM images”, to appear International Symposium for Testing and Failure Analysis (ISTFA), November 2020.
  • L. Lavdas, M. Rahman, M. Tehranipoor, and N. Asadizanjani “On Optical Attacks Making Logic Obfuscation Fragile”, IEEE International Test Conference  (ITC) Asia, September 2020. 
  • O.P. Paradis, N. Varshney, M.T. Rahman, M. Strizich, H. Shen, and N. Asadizanjani, “In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance”, GOMACtech, March 2020.
  • A. Jain, M. Rahman, N. Asadizanjani, and U. Guin, Special Session: Novel Attacks on Logic-Locking, IEEE VLSI Test Symposium, San Diego, CA, 2020.
  • M. Rahman, N. Asadizanjani, Backside Security Assessment of Modern SoCs, IEEE MTV Conference, Austin, TX, 2019.
  • N. Vashistha, M. Rahman, O. Paradis, N. Asadizanjani, Is Backside the New Backdoor in Modern SoCs?, International Test Conference (ITC), Washington, D.C., 2019.
  • R. Wilson, N. Asadizanjani, D. Forte, D. Woodard, “First Auto-Magnifier Platform for Hardware Assurance and Reverse Engineering Integrated Circuits”, Microscopy & Microanalysis (M&M), August 2019.
  • Q. Shi, N. Vashista, H. Lu, H. Shi, D. Woodard, B. Tehranipoor, N. Asadizanjani, “Golden Gates: A New Hybrid Approach for Rapid Hardware Trojan Detection using Testing and Imaging”, Hardware-Oriented Security and Trust (HOST) May 2019. (Best paper candidate to be presented at CHES 2019)
  • C. Eakins, Y. Helal, D. S. Smith, N. Asadizanjani, R. Ott, “Second Order Signature Analysis of Focused Ion Beam Modified Integrated Circuits”, GOMACtech, March 2019.
  • Q. Shi, H. Wang, N. Asadizanjani, M. Tehranipoor, and D. Forte, A Comprehensive Analysis on Vulnerability of Active Shields to Tilted Microprobing Attacks. IEEE Asian Hardware-Oriented Security and Trust (AsianHOST), 2018.
  • T. Rahman, Q. Shi, S. Tajik, H. Shen, D. Woodard, M. Tehranipoor, & N. Asadizanjani, (2018, July). Physical Inspection & Attacks: New Frontier in Hardware Security. In 2018 IEEE 3rd International Verification and Security Workshop (IVSW)(pp. 93-102).
  • H. Shen, M. T. Rahman, N. Asadizanjani, M. Tehranipoor, S. Bhunia, Coating-based PCB Protection against Tampering, Snooping, EM Attack, and X-ray Reverse Engineering, International Symposium for Testing and Failure Analysis (ISTFA), Phoenix, NV, 2018.
  • N. Vashistha, H. Lu, Q. Shi, M. Rahman, H. Shen, D. Woodard, N. Asadizanjani, and M. Tehranipoor, Trojan Scanner: Detecting Hardware Trojans with Rapid Imaging Combined with Image Processing and Machine Learning, International Symposium for Testing and Failure Analysis (ISTFA), Phoenix, NV, 2018. link
  • H. Shen, N. Asadizanjani, M. Tehranipoor, and D. Forte, Nanopyramid An optical scrambler against backside probing attacks, International Symposium for Testing and Failure Analysis (ISTFA), Phoenix, NV, 2018.
  • Nidish Vashistha, M Tanjidur Rahman, Haoting Shen, Damon L Woodard, Navid Asadizanjani, and Mark Tehranipoor. Detecting hardware Trojans inserted by untrusted foundry using physical inspection and advanced image processing. PAINE 2018, workshop digest.
  • E.L. Principe, N. Asadizanjani, D. Forte, M. Tehranipoor, M. DiBattista, R. Chivas, S. Silverman, N. Piche, M. Marsh, J. Mastovich, “Steps Toward Computational Guided Deprocessing of Integrated Circuits” in GOMACTech, March 2018.
  • S. Baireddy, U.J. Botero, N. Asadizanjani, M.Tehranipoor, D. Woodard, D. Forte, “Automated Detection of Counterfeit IC Defects Using Image Processing” in GOMACTech, March 2018.
  • E.L. Principe, N.Asadizanjani, D. Forte, M. Tehranipoor, R. Chivas, M. DiBattista, S.Silverman, M. Marsh, N. Piche, J. Mastovich, “Steps Toward Automated Deprocessing of Integrated Circuits,”  International Symposium for Testing and Failure Analysis (ISTFA), Nov. 2017. (Outstanding Paper Award)
  • Q. Shi, N. Asadizanjani,D. Forte, M. Tehranipoor, “Layout-based Microprobing Vulnerability Assessment for Security Critical Applications,” in GOMACTech, March 2017.
  • N. Asadizanjani, S. Gattigowda,  N. Dunn, M. Tehranipoor, D. Forte, “A Database for Counterfeit Electronics and Automatic Defect Detection Based on Image processing and Machine Learning”, International Symposium for Testing and Failure Analysis (ISTFA), Fort worth, TX, 2016.
  • N. Asadizanjani, D. Forte, M. Tehranipoor, “Non-destructive Bond Pull and Ball Shear Failure Analysis Based on Real Structural Properties”, International Symposium for Testing and Failure Analysis (ISTFA), Fort Worth, TX, 2016.
  • Z. Guo, B. Shakya, H. Chen, S. Bhunia, N. Asadizanjani, D. Forte, M. Tehranipoor, “A New Methodology to Protect PCBs from Non-destructive Reverse Engineering”, International Symposium for Testing and Failure Analysis (ISTFA), Fort Worth, TX, 2016.
  • B. Shakya, N. Asadizanjani, D. Forte, M. Tehranipoor, “Chip Editor: Leveraging Circuit Edit for Logic Obfuscation and Trusted Fabrication,” IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 2016.
  • Q. Shi, N. Asadizanjani, D. Forte, M. Tehranipoor, “A Layout-driven Framework to Assess Vulnerability of ICs to Microprobing Attacks”, Hardware-Oriented Security and Trust (HOST) 2016, May 2016. (Best paper awarded)
  • S. Shahbazmohamadi,N. Asadizanjani, D. Forte, M. Tehranipoor, “Nondestructive X-ray Tomography Based Bond Pull and Ball Shear Analysis” in GOMACTech, March 2016.
  • M M. Alam, N. Asadizanjani, M. Tehranipoor, D. Forte, “The Impact of X-ray Tomography on the Reliability of FPGAs” in GOMACTech, March 2016.
  • N. Asadizanjani, S. Shahbazmohamadi, M. Tehranipoor, D. Forte, “Non-destructive PCB Reverse Engineering Using X-ray Micro Computed Tomography”, International Symposium for Testing and Failure Analysis (ISTFA), Portland, OR, 2015.
  • H. Dogan, M. Alam, N. Asadizanjani, S. Shahbazmohamadi, D. Forte, M. Tehranipoor, “Analyzing the Impact of X-ray Tomography for Non-destructive Counterfeit Detection”, International Symposium for Testing and Failure Analysis (ISTFA), Portland, OR, 2015.
  • N. Asadizanjani, S.E. Quadir, S. Shahbazmohamadi, M. Tehranipoor, D. Forte, “Rapid Non-destructive Reverse Engineering of Printed Circuit Boards by High Resolution X-ray Tomography”, Government Microcircuit applications & Critical Technology Conference (GOMACTech), St. Louis, MO, 2015.
  • N. Asadizanjani, S. Shahbazmohamadi, E.H. Jordan, “X-ray Tomography Imaging of APS TBC Damage Progression”, 39th Int’l Conf & Expo on Advanced Ceramics & Composites (ICACC 2015) proceedings, Daytona beach, January, 2015.
  • N. Asadizanjani, S. Shahbazmohamadi, E.H. Jordan, “Investigation of Surface Geometry Change in Thermal Barrier Coatings Using Computed X-ray Tomography”, 38th Int’l Conf & Expo on Advanced Ceramics & Composites (ICACC 2014) proceedings, Daytona beach, January, 2014.
  • N. Asadizanjani, S. Shahbazmohamadi, E.H. Jordan, “Investigation of Cracks Behavior Correlatred with Interface Geometry in TBC Systems Using 3D Non-Destructive Imaging”, Material Science & Technology, Pittsburgh, 2014.
  • N. Asadizanjani, S. Shahbazmohamadi, E.H. Jordan, “Non-destructive 3D Investigation of Cracks Evolution in thermal Barrier Coatings”, Amira-Avizo User Group Meeting 2014, Boston, October 2014.
  • S. Shahbazmohamadi , N. Asadizanjani, , E.H. Jordan, “Statistical Analysis of Evolution of Rumpling in Thermal Barrier Coatings Using Advanced 3D Imaging Techniques” Materials Science and Technology (MS&T), Quebec, Canada, October, 2013.
  • M.K. Fisches, D.O. Kazmer, R.X. Gao, G.W. Gordon, Z. Fan, N. Asadizanjani, “Verification of rheological mixing rules to the application of masterbatches”, Annual Technical Conference – ANTEC, Conference Proceedings, 2, pp. 1073-1078, 2013.
  • G.W. Gordon, D.O. Kazmer, R.X. Gao, Z. Fan, N. Asadizanjani, “Temperature modeling for a multivariate injection molding sensor”, Annual Technical Conference – ANTEC, Conference Proceedings, 2, pp. 1103-1110, 2013.
  • D. O. Kazmer, S.P. Johnston, G.W. Gordon, R.X. Gao , Z. Fan, N. Asadizanjani, “A multivariate in-mold sensor design for measurement of melt pressure, temperature, velocity, and viscosity”, Annual Technical Conference – ANTEC, Conference Proceedings, 2, pp. 1559-1566, 2012.
  • Z. Fan, R.X. Gao, N. Asadizanjani, and D.O. Kazmer, “Coded acoustic wave modulation for multi-parameter transmission.” In Instrumentation and Measurement Technology Conference (I2MTC), 2012 IEEE International, pp. 2236-2241, 2012.
  • N. Asadizanjani, R.X. Gao, Z. Fan, and D.O. Kazmer, “Viscosity Measurement in Injection Molding Using a Multivariate Sensor.” In ASME/ISCIE 2012 International Symposium on Flexible Automation, pp. 231-237. American Society of Mechanical Engineers, 2012. (Best paper awarded)
  • R. X. Gao, Z. Fan, N. Asadizanjani, and D.O. Kazmer, “A new method for determining melt front velocity through temperature measurement.” InASME 2011 Dynamic Systems and Control Conference and Bath/ASME Symposium on Fluid Power and Motion Control, pp. 167-172. American Society of Mechanical Engineers, 2011.