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CONFERENCE ORGANIZATION

  • Organizing Conferences/Workshops/Special Sessions/Tutorials/Forums/Panels:
    • Founding Member and Program Chair, IEEE International Conference on Intelligent Computing at the Edge (ICEdge), 2025: https://icedge.org/
    • Workshop Organizer, “Workshop on Intelligent Connected Internet of Bodies (IC-IoB): where body-electronics builders meet” – co-located with the IEEE Custom Integrated Circuits Conference (CICC), Seattle, USA, 2026.
    • Workshop Organizer, “CASS Workshop on Intelligent Connected Wearables and Implants for Next-Generation Bioelectronics” – co-located with the IEEE International Biomedical Circuits and Systems Conference (BioCAS), Abu Dhabi, UAE, 2025.
    • Organized a Special Session on “Secure Connectivity and In-sensor-Intelligence in Resource-Constrained Smart Wearables and Implants” in the IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), Lansing, USA, 2025.
    • Program Organizer , 1-day Workshop on “Intelligent Computing and Systems at the Edge (ICE)”, 37th IEEE Int. Conference on VLSI Design (VLSID), Kolkata, India, 2024.
    • Organized a Special Poster Session on “Next-Gen Wearables and Implants: Harnessing the Power of the Internet of Bodies (IoB)” in the IEEE International Biomedical Circuits and Systems Conference (BioCAS), Toronto, Canada, 2023.
    • Organized a Special Session on “Pioneering Wireless Technologies for Wearables and Implants” in the IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), Phoenix, USA, 2023.
  • Involvement in Conference Technical Program Committee (TPC)/Review Committee:
    • TPC Member, Design Verification and Validation Subcommittee, ACM/IEEE Design Automation Conference (DAC), 2026-Present.
    • TPC Member, Systems and Security Subcommittee, IEEE Custom Integrated Circuits Conference (CICC), 2025-Present.
    • Track Chair, Biomedical Circuits and Systems Subcommittee, IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), 2025-Present.
    • Member of Best Paper Award Committee, IEEE Custom Int. Circuits Conference (CICC), 2025.
    • TPC Chair, IEEE International Conference on Intelligent Computing at the Edge (ICEdge), 2025.
    • TPC Member, International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES), Embedded Systems Week, 2024-Present.
    • Member of Best Paper Award Committee, International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES), Embedded Systems Week, 2024.
    • Track Chair, Analog Subcommittee, IEEE Int. Conference on VLSI Design (VLSID), 2024.Associate Editor,IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS): 2023 (Special Sessions), 2025 (Biomedical Circuits and Systems; Special Sessions).
    • Review Committee Chair, Special Session on “Next-Gen Wearables and Implants: Harnessing the Power of the Internet of Bodies (IoB)”, IEEE International Biomedical Circuits and Systems Conference (BioCAS), 2023.
    • TPC Member, IEEE International Conference on VLSI Design (VLSID), 2022, 2024-Present.
    • Student Advisor for the Student Research Preview (SRP) session in IEEE International Solid-State Circuits Conference (ISSCC), 2020
  • Serving as Session Chair/Moderator/Panelist:
    • Moderator for the Workshop Panel on “When are we going to get Invisible Sensors, and What needs to Change in the Current Practices for that,” IEEE International Biomedical Circuits and Systems Conference (BioCAS), Abu Dhabi, UAE, 2025.
    • Session Chair in multiple sessions during IEEE Int. Midwest Symp. on Circuits and Systems (MWSCAS), 2025: (1) “Wireline and Optical Communication Circuits and System”, (2) “Secure Connectivity and In-Sensor-Intelligence in Resource-Constrained Smart Wearables & Implants”, (3) “Power & Energy Circuits and Systems I”, (4) “Analog Circuits for High Speed and RF”.
    • Session Chair in “Systems and Security – I” and “Systems and Security – II” Sessions, IEEE Custom Integrated Circuits Conference (CICC), 2025.
    • Panelist in “Medical Wearables Panel: Past, Present and Future”, during CASS Workshop, IEEE Int.  Biomedical Circuits and Systems Conference (BioCAS), 2024.
    • Session Chair in “Bio & Bioelectric Sensors” Session, IEEE Engineering in Medicine and Biology Society Conference (EMBC), 2024.
    • Session Chair in the “Analog and Mixed-Signal (AMS)” Session, IEEE Int. Conference on VLSI Design (VLSID), 2024.
    • Moderator for the Academia + Industry Panel on “AIoT for the Future and the Role that India will Play,” IEEE Int. Conference on VLSI Design (VLSID), 2024.
    • Session Chair in the “Pioneering Wireless Technologies for Wearables and Implants” Session, IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), 2023.
    • Panelist in “Young Professionals Panel: Navigating Your Career in CAS”, during IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), 2023. 

ASSOCIATE EDITOR

  •  Associate Editor, IEEE Transactions on Biomedical Circuits and Systems (TBioCAS), 2026-2027.
  • Associate Editor, Frontiers in Antennas and Propagation, RFID Section (Aug 2022 – Present).
  • Senior Associate Editor, International Analog ICs and Signal processing (AICSP) Journal, Springer. (June 2025 – Present).

GUEST EDITOR

  • Special Issue on Energy-Efficient RF Circuits for Wearable Biomedical Sensors, MDPI Sensors
  • Special Issue on Circ. and Syst. for Body Area Sensor Networks, MDPI Sensors (Mar 2023 – Apr 2024)
  • Frontiers in Antennas and Propagation, Antenna Arrays Section (Aug 2022 – Present)

REVIEWER FOR JOURNALS

  • – Advanced Science: IF 15.1
  • – IEEE Internet of Things Journal (IOT-J) : IF 10.6
  • – IEEE Transactions on Mobile Computing (TMC) : IF 7.9
  • – IEEE Transactions on Dependable and Secure Computing (TDSC) : IF 7.3
  • – IEEE Journal of Solid-State Circuits (JSSC) : IF 6.12
  • – IEEE Transactions on Circuits and Systems- I (TCAS-I) : IF 5.2
  • – IEEE Transactions on Biomedical Circuits and Systems (TBioCAS) : IF 5.23
  • – IEEE Transactions on Biomedical Engineering (TBME) : IF 4.75
  • – IEEE Transactions on Network and Service Management (TNSM) : IF 5.4
  • – IEEE Transactions on Circuits and Systems- II (TCAS-II) : IF 3.69
  • – IEEE Journal on Emerging Technologies in Computing Systems (JETC): : IF 3.7
  • – IEEE Transactions on Very Large Scale Integration (TVLSI) : IF 3.1
  • – IEEE Microwave and Wireless Components Letters (MWCL) : IF 2.86
  • – IEEE Solid-State Circuits Letters (L-SSC): : IF 2.05
  • – IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) : IF 2.9
  • – IEEE Design and Test Magazine (D&T) : IF 2.0
  • – IEEE Sensors Journal: IF 4.3
  • – IEEE Access : IF 3.4
  • – Engineering Reports : IF 1.8
  • – IEEE Journal of Emerging & Selected Topics in Circuits and Systems (JETCAS – Secondary Reviewer)
  • – Frontiers in Neuroscience – Section Neuromorphic Engineering (Secondary Reviewer)

REVIEWER FOR CONFERENCES

  • – IEEE Custom Integrated Circuits Conference (CICC)
  • – SRP session in IEEE International Solid-State Circuits Conference (ISSCC), 2020
  • – ACM/IEEE Design Automation Conference (DAC – Secondary Reviewer)
  • – IEEE Design, Automation & Test in Europe (DATE – Secondary Reviewer)
  • – IEEE International Symposium of Circuits and Systems (ISCAS)
  • – IEEE International Conference on VLSI Design (VLSID)
  • – International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
  • – IEEE International Conference on Computer Aided Design (ICCAD – Secondary Reviewer)
  • – IEEE International Symposium on Low Power Electronics & Design (ISLPED – Secondary Reviewer)
  • – IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
  • – International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES)

OTHERS

  • – Serving as an NSF reviewer, 2024-present.
  • – Reviewer for the ORAU Ralph E Powe Junior Faculty Enhancement Awards 2025, Engineering and Applied Science Panel
  • – Served in the Secondary Reviewer Pool for applications to the NASA Postdoctoral Program (NPP), 2023 Cycle
  • – Member of the IEEE: 2010-Present. Present member of Societies: Solid-State Circuits Society (SSCS), Circuits and Systems Society (CASS), Microwave Theory and Technology Society (MTT-S), Engineering in Medicine and Biology Society (EMBS).
  • – Member of ACM: 2023-Present