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Service & Teaching

CONFERENCE ORGANIZATION

    • >>> Organizing Conferences/Workshops/Special Sessions/Tutorials/Forums/Panels:
      • – Founding Member and Program Chair, IEEE International Conference on Intelligent Computing at the Edge (ICEdge), 2025: https://icedge.org/
      • – Workshop Proposer and Organizer, “CASS Workshop on Intelligent Connected Wearables and Implants for Next-Generation Bioelectronics” co-located with the IEEE International Biomedical Circuits and Systems Conference (BioCAS), Abu Dhabi, UAE, 2025.
      • – Organized a Special Session on “Secure Connectivity and In-sensor-Intelligence in Resource-Constrained Smart Wearables and Implants” in the IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), Lansing, USA, 2025.
      • – Program Organizer , 1-day Workshop on “Intelligent Computing and Systems at the Edge (ICE)”, 37th IEEE Int. Conference on VLSI Design (VLSID), Kolkata, India, 2024.  The Full program is available here.
      • – Organized a Special Poster Session on “Next-Gen Wearables and Implants: Harnessing the Power of the Internet of Bodies (IoB)” in the IEEE International Biomedical Circuits and Systems Conference (BioCAS), Toronto, Canada, 2023.
      • – Organized a Special Session on “Pioneering Wireless Technologies for Wearables and Implants” in the IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), Phoenix, USA, 2023.

     

    • >>> Involvement in Conference Technical Program Committee (TPC)/Review Committee:
      • – TPC Member, Systems and Security Subcommittee, IEEE Custom Integrated Circuits Conference (CICC), 2025-Present.
      • – Track Chair, Biomedical Circuits and Systems Subcommittee, IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), 2025-Present.
      • – Member of Best Paper Award Committee, IEEE Custom Int. Circuits Conference (CICC), 2025.
      • – TPC Chair, IEEE International Conference on Intelligent Computing at the Edge (ICEdge), 2025.
      • – TPC Member, International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES), Embedded Systems Week, 2024-Present.
      • – Member of Best Paper Award Committee, International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES), Embedded Systems Week, 2024.
      • – Track Chair, Analog Subcommittee, IEEE Int. Conference on VLSI Design (VLSID), 2024.
      • – Associate Editor, IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS): 2023 (Special Sessions), 2025 (Biomedical Circuits and Systems; Special Sessions)
      • – Review Committee Chair, Special Session on “Next-Gen Wearables and Implants: Harnessing the Power of the Internet of Bodies (IoB)”, IEEE International Biomedical Circuits and Systems Conference (BioCAS), 2023
      • – Review Committee/TPC Member, IEEE International Conference on VLSI Design (VLSID), 2022, 2024-Present.
      • – Student Advisor for the Student Research Preview (SRP) session in IEEE International Solid-State Circuits Conference (ISSCC), 2020

     

    • >>> Serving as Session Chair/Moderator/Panelist:
      • – Session Chair in the following sessions in IEEE Int. Midwest Symp. on Circuits and Systems (MWSCAS), 2025: (1) “Wireline and Optical Communication Circuits and System”, (2) “Secure Connectivity and In-Sensor-Intelligence in Resource-Constrained Smart Wearables and Implants”, (3) “Power and Energy Circuits and Systems I”, (4) “Analog Circuits for High Speed and RF”.
      • – Session Chair in “Systems and Security – I” and “Systems and Security – II” Sessions, IEEE Custom Integrated Circuits Conference (CICC), 2025.
      • – Panelist in “Medical Wearables Panel: Past, Present and Future”, during CASS Workshop, IEEE Int. Biomedical Circuits and Systems Conference (BioCAS), 2024.
      • – Session Chair in “Bio & Bioelectric Sensors” Session, IEEE Engineering in Medicine and Biology Society Conference (EMBC), 2024.
      • – Session Chair in the “Analog and Mixed-Signal (AMS)” Session, IEEE Int. Conference on VLSI Design (VLSID), 2024.
      • – Moderator for the Academia + Industry Panel on “AIoT for the Future and the Role that India will Play,” IEEE Int. Conference on VLSI Design (VLSID), 2024.
      • – Session Chair in the “Pioneering Wireless Technologies for Wearables and Implants” Session, IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), 2023
      • – Panelist in “Young Professionals Panel: Navigating Your Career in CAS”, during IEEE Int. Midwest Symposium on Circuits and Systems (MWSCAS), 2023.

 

ASSOCIATE EDITOR

  • – Associate Editor, Frontiers in Antennas and Propagation, RFID Section (Aug 2022 – Present)
  • – Senior Associate Editor, International Analog ICs and Signal processing (AICSP) Journal, Springer. (June 2025 – Present)

 

GUEST EDITOR

  • – Special Issue on Circuits and Systems for Body Area Sensor Networks, Sensors (MDPI) (March 2023 – Apr 2024)
  • – Frontiers in Antennas and Propagation, Antenna Arrays Section

 

REVIEWER FOR JOURNALS

  • – Advanced Science: IF 15.1
  • – IEEE Internet of Things Journal (IOT-J) : IF 10.6
  • – IEEE Transactions on Mobile Computing (TMC) : IF 7.9
  • – IEEE Transactions on Dependable and Secure Computing (TDSC) : IF 7.3
  • – IEEE Journal of Solid-State Circuits (JSSC) : IF 6.12
  • – IEEE Transactions on Circuits and Systems- I (TCAS-I) : IF 5.2
  • – IEEE Transactions on Biomedical Circuits and Systems (TBioCAS) : IF 5.23
  • – IEEE Transactions on Biomedical Engineering (TBME) : IF 4.75
  • – IEEE Transactions on Network and Service Management (TNSM) : IF 5.4
  • – IEEE Transactions on Circuits and Systems- II (TCAS-II) : IF 3.69
  • – IEEE Journal on Emerging Technologies in Computing Systems (JETC): : IF 3.7
  • – IEEE Transactions on Very Large Scale Integration (TVLSI) : IF 3.1
  • – IEEE Microwave and Wireless Components Letters (MWCL) : IF 2.86
  • – IEEE Solid-State Circuits Letters (L-SSC): : IF 2.05
  • – IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) : IF 2.9
  • – IEEE Design and Test Magazine (D&T) : IF 2.0
  • – IEEE Sensors Journal: IF 4.3
  • – IEEE Access : IF 3.4
  • – Engineering Reports : IF 1.8
  • – IEEE Journal of Emerging & Selected Topics in Circuits and Systems (JETCAS – Secondary Reviewer)
  • – Frontiers in Neuroscience – Section Neuromorphic Engineering (Secondary Reviewer)

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REVIEWER FOR CONFERENCES

  • – IEEE Custom Integrated Circuits Conference (CICC)
  • – SRP session in IEEE International Solid-State Circuits Conference (ISSCC), 2020
  • – ACM/IEEE Design Automation Conference (DAC – Secondary Reviewer)
  • – IEEE Design, Automation & Test in Europe (DATE – Secondary Reviewer)
  • – IEEE International Symposium of Circuits and Systems (ISCAS)
  • – IEEE International Conference on VLSI Design (VLSID)
  • – International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
  • – IEEE International Conference on Computer Aided Design (ICCAD – Secondary Reviewer)
  • – IEEE International Symposium on Low Power Electronics & Design (ISLPED – Secondary Reviewer)
  • – IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
  • – International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES)

 

OTHERS

  • – Serving as an NSF reviewer, 2024-present.
  • – Reviewer for the ORAU Ralph E Powe Junior Faculty Enhancement Awards 2025, Engineering and Applied Science Panel
  • – Served in the Secondary Reviewer Pool for applications to the NASA Postdoctoral Program (NPP), 2023 Cycle
  • – Member of the IEEE: 2010-Present. Present member of Societies: Solid-State Circuits Society (SSCS), Circuits and Systems Society (CASS), Microwave Theory and Technology Society (MTT-S), Engineering in Medicine and Biology Society (EMBS).
  • – Member of ACM: 2023-Present

 

 

Teaching: EEE 3308C (Electronic Circuits 1):

Undergraduate-level ECE Course at the University of Florida

  • Taught this course in Fall 2022 (class strength: 63), Fall 2023 (class strength: 79), Fall 2024 (class strength: 73), and Fall 2025 (class strength: 87). 
  • This course serves as a basic primer for the young circuit designer and covers topics starting from KCL, KVL, basic electrical circuit analysis, DIodes, BJTs, MOSFETs and MOSFET based circuits (single-stage/multi-stage amplifiers, differential amplifiers, current mirrors, Op-Amps), along with some advanced concepts such as frequency response, feedback, and noise. A lot of emphasis is placed on building circuit intuition than just solving equations, and all the important concepts are accompanied with a hands-on lab section where students build circuits on breadboards and/or general-purpose PCBs and learn the basics of measurement techniques. Spice simulations and models are introduced to show different concepts in a design-oriented manner.

     

    Resources:

    1. Op-Amp Design Tool:

    Use this spreadsheet to design a 2 stage Op-Amp from Specifications. This uses the method provided in Allen-Holberg (3e) and does not use the gm/Id method due to technology restrictions. Only Online Access is permitted (no reproduction/copy/download) – Please contact chatterjee.b@ufl.edu if you need to use it elsewhere.

 

Teaching: EEE 6935 (High-Speed ICs for Mixed-Signal Link Design in Internet of Everything):

New Graduate-level ECE Course at the University of Florida

  • Taught this course in Spring 2025 (class strength: 14)
  • Overall, this course serves as a gateway to how analog and mixed-signal circuit design is being done in today’s industry, using pre-computed look-up tables instead of basic equations found in textbooks. The course covers topics such as (1) System-level specification design for Analog/Digital/Mixed-Signal circuits, (2) MOSFET based circuit constructs, (3) Systematic design of MOSFET based circuits using pre-computed look-up tables, (4) Wireline and Wireless Links in the Internet of Everything, (5) Sampler/Strong-Arm Latches as 1-bit ADC, (6) CTLE, FFE and DFE in Wireline Links, (7) Oscillators, VCOs, PLLs and CDRs, (8) Resistive Feedback LNAs, (9) N-path mixers, (10) Switched Capacitor circuits.
  • (NEW) Introducing Tapeouts funded by the CEMiD program in Spring 2026.

 

Teaching: EEE 6321 (Analog IC Design 2):

Graduate-level ECE Course at the University of Florida

  • Taught this course in Spring 2023 (class strength: 34)
  • (excerpt from EEE6321_Analog_IC_Design_2_Maghari_Spring_2022.pdf (ufl.edu)) This course follows up on the topics discussed in Analog IC 1 and extends it to feedback, opamp types, switched-capacitor circuits, layout and matching, noise and other important aspects of IC design. We will continue to use Cadence® platform, an industry preferred simulation and layout engine. The course objective is to provide a thorough background of analog circuits, discuss the real world applications, IC design challenges and prepares students for other areas of analog and digital IC design. If you plan to pursue career in IC design, either analog or digital, this course is “a must”, and it is recommended by ALL IC design companies.
  • This course was awarded the most affordable UF ECE class in terms of the total cost of the course material, offset by the cost of material provided by the university and the department.

Resources:

1. Op-Amp Design Tool:

Use this spreadsheet to design a 2 stage Op-Amp from Specifications. This uses the method provided in Allen-Holberg (3e) and does not use the gm/Id method due to technology restrictions. Only Online Access is permitted (no reproduction/copy/download) – Please contact chatterjee.b@ufl.edu if you need to use it elsewhere.

 

Teaching: ECE 695 (High-Speed Mixed Signal IC):

Graduate-level ECE Course at Purdue University, USA

  • Assisted in developing the course structure, designing homework assignments, designing examinations and grading for Fall 2021 term, with 21 students enrolled in the class.
  • As a Graduate Instructor, taught one 1.5-hour lecture per week (in-class presentations)for Fall 2021 term, along with discussion sessions.

 

Teaching: ECE 595 (Quantum Circuits and Systems):

Graduate-level ECE Course at Purdue University, USA

  • Assisting in developing the course structure, content and assessment criteria-first offering to be made in Fall 2023