{"id":734,"date":"2019-09-30T15:35:31","date_gmt":"2019-09-30T20:35:31","guid":{"rendered":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/?page_id=734"},"modified":"2026-02-12T14:22:25","modified_gmt":"2026-02-12T19:22:25","slug":"invited-talks","status":"publish","type":"page","link":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/invited-talks\/","title":{"rendered":"Invited Talks"},"content":{"rendered":"<ul>\n<li><strong>Google, May 2025, <\/strong>AI for Inspection in Advanced Electronics System and Components<\/li>\n<li><strong>SEMIEXPO, March 2025, <\/strong>Addressing the Automation and Workforce Needs in Advanced Packaging<\/li>\n<li><strong>NHanced, March 2025, <\/strong>Challenges of Inspection in Hybrid Bonding<\/li>\n<li><strong>NSF, March 2025, <\/strong>Next Generation low Noise X-ray Imaging<\/li>\n<li><strong>FSI Summit, February 2025, <\/strong>Introduction to Advanced Packaging<\/li>\n<li><strong>HIR February 2025, <\/strong>Hardware Security Chapter<\/li>\n<li><strong>NYU AbuDhabi, December 2024, <\/strong>An Overview on Electronics Inspection<\/li>\n<li><strong>KEYNOTE SPACE India, December 2024, <\/strong>The Role of Physical in Microelectronics Assurance<\/li>\n<li><strong>iSES India, December 2024, <\/strong>Advanced Packaging X-ray Analysis<\/li>\n<li><strong>AFRL Eglin, December 2024,<\/strong> Multi-modal Analysis for Assurance<\/li>\n<li><strong>ESREF, September 2024,<\/strong> Hardware Security Meets Failure Analysis<\/li>\n<li><strong>NAVAIR, June 2024, <\/strong>Security of Printed Circuit Boards<\/li>\n<li><strong>AIM Photonics, July 2024, <\/strong>Role of Physical Assurance in Advanced Packaging<\/li>\n<li><strong>University of Binghamton, June 2024, <\/strong>Physical Assurance for Advanced Packaging<\/li>\n<li><strong>NVIDIA Silicon Engineering Team, February 2024<\/strong>, Optical Probing for Assurance<\/li>\n<li><strong>iNEMI Tech Topic Series, December 2023,<\/strong> Understanding Counterfeit Detection and Mitigation<\/li>\n<li><strong>Arizona State University, November 2023,<\/strong> New Trends for Advanced Packaging Assurance<\/li>\n<li><strong>KEYNOTE ACM ISCA &#8211; HipChips, Orlando, June 2023<\/strong>, Assurance from Chiplets to Systems<\/li>\n<li><strong>DRAPER GBC Tech Talk, May 2023,<\/strong> Packaging Assurance and Inspection<\/li>\n<li><strong>KEYNOTE ACM ISCA &#8211; HipChips, Orlando, June 2023<\/strong>, Assurance from Chiplets to Systems<\/li>\n<li><strong>DRAPER GBC Tech Talk, May 2023,<\/strong> Packaging Assurance and Inspection<\/li>\n<li><strong>KEYNOTE<\/strong> <strong>CAM Conference,<\/strong> <strong>Halle &#8211; Germany, April 2023<\/strong>, Physical Assurance for Advanced Packaging<\/li>\n<li><strong>Intel, April 2023,<\/strong> Advanced Packaging and Heterogeneous Integration Assurance<\/li>\n<li><strong>Applied Materials, March 2023,<\/strong> An Overview to Advanced Packaging Assurance<\/li>\n<li><strong>Meta, February 2023,<\/strong> Physical Assurance of Datacenters<\/li>\n<li><strong>NIST, January 2023,<\/strong> Multi Modal Probing Techniques for Assurance.<\/li>\n<li><strong>NIST Industrial Advisory Committee,<\/strong> <strong>January 2023,<\/strong> Future of workforce for CHIPS Act.<\/li>\n<li><strong>Invariant Corp., January 2023,<\/strong> Workforce development for advanced packaging<\/li>\n<li><strong>Raytheon, November 2022,<\/strong> FA for Assurance<\/li>\n<li><strong>Nanyang Technical University, July 2022,<\/strong> Lessons learned on Physical Assurance for Electronics.<\/li>\n<li><strong>IEEE IPFA Conference, July 2022,<\/strong> Electronics Physical Assurance, Challenges and Opportunities<\/li>\n<li><strong>EDFAS Lonestar Chapter\u2019s Series, September 2021,<\/strong> Physical Assurance for Electronics.<\/li>\n<li><strong>Virtual Workshop on Machine Learning &amp; Hardware Security, September 2021,<\/strong> Machine Leanring for Physical Assurance<\/li>\n<li><strong>GLC, August 2021,<\/strong> Security of Interposers<\/li>\n<li><strong>IEEE MDTS, May 2021,<\/strong> Physical Assurance for Package Security<\/li>\n<li><strong>IEEE Oregon Computer Society webinar, April 2021,\u00a0<\/strong>Role of Physical Assurance in Electronics<\/li>\n<li><strong>KEYNOTE CMSE conference, April 2021,<\/strong> Physical assurance for Military and Space Electronics<\/li>\n<li><strong>MEPTEC, April 2021,<\/strong> Physical Assurance for Microelectronics<\/li>\n<li><strong>Material Science Department, University of Florida, March 2021, <\/strong>Materials for Hardware Security<\/li>\n<li><strong>Facebook, March 2021, <\/strong>Pro and Cons of Physical Assurance for Electronics<\/li>\n<li><strong>KSMC, March 2021, <\/strong>Fingerprinting for Physical Assurance<\/li>\n<li><strong>Navy, March 2021, <\/strong>Advanced X-ray Reconstruction for PCB Assurance<\/li>\n<li><strong>Riscure Webinar Series, March 2021, <\/strong>Optical Probing Attacks<\/li>\n<li><strong>MEST Webinar Series, March 2021, <\/strong>Contactless Attacks on Chip Backside<\/li>\n<li><strong>Synopsys, February 2021, <\/strong>X-ray Image Reconstruction and Segmentation for PCB Assurance<\/li>\n<li><strong>IEEE Asian ITC, September 2020, <\/strong>Emerging Attacks on Microelectronics<\/li>\n<li><strong>IEEE VTS, April 2020,<\/strong> Novel Attacks on Logic Locking<\/li>\n<li><strong>AvMc, February 2020,<\/strong> Optical Probing for Security<\/li>\n<li><strong>Intel, December 2019, <\/strong>The role of physical inspection in hardware assurance.<\/li>\n<li><strong>MTVCON, December 2019,<\/strong> Backside Security Assessment of ICs<\/li>\n<li><strong>ITC, November 2019,<\/strong> Is Backside the New Backdoor in Modern SoCs<\/li>\n<li><strong>ITC-Sky talk<\/strong>, <strong>November 2019<\/strong> , Holistic approach for PCB assurance, (<strong>first place selected by Venture Capitals committee<\/strong>).<\/li>\n<li><strong>Air Force Research Laboratory AFRL, October, 2019,<\/strong> Physical Inspection and assurance.<\/li>\n<li><strong>Edpative<\/strong> <strong>Computing Inc., October, 2019, <\/strong>Automated Bill of Material.<\/li>\n<li><b>Lockheed Martin, September 2019, <\/b>Knowledge guided approach for PCB Assurance.<\/li>\n<li><strong>Physical Assurance and INspection on Electronics (PAINE), July 2019,\u00a0 <\/strong>A New Framework for Automated Bill of Material Extraction for PCB Assurance.<\/li>\n<li><strong>Cisco Research Center, <\/strong>December, 2018, A Basic Framework for PCB Reverse Engineering, Analysis and Defect Diagnosis.<\/li>\n<li><strong>IEEE 3rd International Verification and Security Workshop (IVSW), July 2018<\/strong>, Physical Inspection &amp; Attacks: New Frontier in Hardware Security.<\/li>\n<li><strong>International Conference on Communication, Imaging and Signal Processing (CCISP), Dubai, November 2016, <\/strong>Counterfeit Electronics Detection Using Image Processing and Machine Learning.<\/li>\n<li><strong>Society of Photographic Instrumentation Engineers (SPIE), August 2015<\/strong>, A review on THz characterization of electronic components and a comparison of THz imaging characterization with other techniques.<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Google, May 2025, AI for Inspection in Advanced Electronics System and Components SEMIEXPO, March 2025, Addressing the Automation and Workforce Needs in Advanced Packaging NHanced, March 2025, Challenges of Inspection in Hybrid Bonding NSF, March 2025, Next Generation low Noise X-ray Imaging FSI Summit, February 2025, Introduction to Advanced Packaging HIR February 2025, Hardware Security [&hellip;]<\/p>\n","protected":false},"author":0,"featured_media":0,"parent":0,"menu_order":8,"comment_status":"closed","ping_status":"closed","template":"page-templates\/page-sidebar-none.php","meta":{"_acf_changed":false,"inline_featured_image":false,"featured_post":"","footnotes":"","_links_to":"","_links_to_target":""},"class_list":["post-734","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/pages\/734","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/types\/page"}],"replies":[{"embeddable":true,"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/comments?post=734"}],"version-history":[{"count":1,"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/pages\/734\/revisions"}],"predecessor-version":[{"id":1343,"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/pages\/734\/revisions\/1343"}],"wp:attachment":[{"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/media?parent=734"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}