{"id":11,"date":"2015-11-03T15:53:38","date_gmt":"2015-11-03T20:53:38","guid":{"rendered":"https:\/\/test.eng.ufl.edu\/faculty-site\/?page_id=11"},"modified":"2026-02-12T15:32:18","modified_gmt":"2026-02-12T20:32:18","slug":"publications","status":"publish","type":"page","link":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/publications\/","title":{"rendered":"Publications"},"content":{"rendered":"\n<p>Google Scholar Page: <a href=\"https:\/\/scholar.google.com\/citations?user=xsHD2SgAAAAJ\">link<\/a><\/p>\n\n\n\n<p>YouTube Channel: <a href=\"https:\/\/www.youtube.com\/playlist?list=PLe7niMUMEviOjBl1QLG6QKpyXRHEEifLv\">Link<\/a><\/p>\n\n\n\n<p>Repository of Physical Images: <a href=\"https:\/\/physicaldb.ece.ufl.edu\/\">Link<\/a><\/p>\n\n\n\n<h4 class=\"wp-block-heading\">Books<\/h4>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><div class=\"wp-block-image\">\n<figure class=\"alignleft size-medium is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"188\" height=\"300\" src=\"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book1-188x300.png\" alt=\"\" class=\"wp-image-1289\" style=\"aspect-ratio:0.6267125071625775;width:188px;height:auto\" srcset=\"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book1-188x300.png 188w, https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book1.png 262w\" sizes=\"auto, (max-width: 188px) 100vw, 188px\" \/><\/figure>\n<\/div>\n\n\n<div style=\"height:10px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p><a href=\"https:\/\/link.springer.com\/book\/10.1007\/978-3-030-62609-9\" data-type=\"link\" data-id=\"https:\/\/link.springer.com\/book\/10.1007\/978-3-030-62609-9\" target=\"_blank\" rel=\"noreferrer noopener\">Physical Assurance<\/a><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><div class=\"wp-block-image\">\n<figure class=\"alignleft size-medium\"><img loading=\"lazy\" decoding=\"async\" width=\"199\" height=\"300\" src=\"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book2-199x300.png\" alt=\"\" class=\"wp-image-1291\" srcset=\"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book2-199x300.png 199w, https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book2.png 276w\" sizes=\"auto, (max-width: 199px) 100vw, 199px\" \/><\/figure>\n<\/div>\n\n\n<div style=\"height:10px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p><a href=\"https:\/\/shop.elsevier.com\/books\/materials-for-electronics-security-and-assurance\/asadizanjani\/978-0-443-18542-7\" data-type=\"link\" data-id=\"https:\/\/shop.elsevier.com\/books\/materials-for-electronics-security-and-assurance\/asadizanjani\/978-0-443-18542-7\" target=\"_blank\" rel=\"noreferrer noopener\">Materials for Electronics Security and Assurance<\/a><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><div class=\"wp-block-image\">\n<figure class=\"alignleft size-medium\"><img loading=\"lazy\" decoding=\"async\" width=\"211\" height=\"300\" src=\"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book3-211x300.jpg\" alt=\"\" class=\"wp-image-1293\" srcset=\"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book3-211x300.jpg 211w, https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2025\/06\/book3.jpg 671w\" sizes=\"auto, (max-width: 211px) 100vw, 211px\" \/><\/figure>\n<\/div>\n\n\n<div style=\"height:10px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p><a href=\"https:\/\/link.springer.com\/book\/10.1007\/978-3-031-86102-4\" data-type=\"link\" data-id=\"https:\/\/link.springer.com\/book\/10.1007\/978-3-031-86102-4\" target=\"_blank\" rel=\"noreferrer noopener\">Introduction to Microelectronics Advanced Packaging Assurance<\/a><\/p>\n<\/div>\n<\/div>\n\n\n\n<h4 class=\"wp-block-heading\">Book Chapter<\/h4>\n\n\n\n<p><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>N. Asadizanjani, <\/strong>Counterfeit Integrated Circuits: Detection and Avoidance, Springer, 2015, chapters 3 and 7.<\/li>\n\n\n\n<li>B. Shakya, X. Xu, <strong>N. Asadizanjani,<\/strong> M. Tehranipoor,\u00a0D. Forte, &#8220;Leveraging Circuit Edit for Low-Volume Trusted Nanometer Fabrication&#8221;, in\u00a0Security Opportunities in Nano Devices and Emerging Technologies\u00a0by Mark M. Tehranipoor, Domenic Forte, Garrett Rose, and Swarup Bhunia, CRC Press, 2017.<\/li>\n<\/ul>\n\n\n\n<p><u>Journal Publications <\/u><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>M.A.M. Sathiaseelan, O.P. Paradis, S. Taheri, and <strong>N. Asadizanjani<\/strong>, \u201cWhy Is Deep Learning Challenging for Printed Circuit Board (PCB) Component Recognition and How Can We Address It?\u201d, Cryptography 2021, 5, 9.<\/li>\n\n\n\n<li>D. Mehta, H. Lu, O. Paradis, M. Azhagan, Y. Iskander, P. Chawla, D. L. Woodard, M. Tehranipoor, and <strong>N. Asadizanjani<\/strong>, \u201cThe Big Hack Explained: Detection and Prevention of PCB Supply Chain Implants\u201d, ACM Journal on Emerging Technologies in Computing Systems (JETC), vol. 14 no. 4, pg. 1 \u2013 42, 2020<\/li>\n\n\n\n<li>M. T. Rahman, N. F. Dipu, D. Mehta, S. Tajik, Ma. Tehranipoor, and <strong>N. Asadizanjani<\/strong>\u00a0&#8220;CONCEALING-Gate: Contactless Optical Probing Resilient Design&#8221; to appear on Journal on Emerging Technologies in Computing Systems (JETC), 2020.\u00a0<\/li>\n\n\n\n<li>N. Jessurun, O. P. Paradis, A. Roberts, <strong>N. Asadizanjani<\/strong>, Component Detection and Evaluation Framework (CDEF): A Semantic Annotation Tool, Microscopy and Microanalysis, 1-5, 2020.<\/li>\n\n\n\n<li>N. Varshney, H. Shen, O. P. Paradis, <strong>N. Asadizanjani,<\/strong> (2020). He-ion Beam Imaging for Accurate Hardware Trojan Detection. Microscopy and Microanalysis, 1-3, 2020.<\/li>\n\n\n\n<li>K. Ahi, N. Jessurun, M. Hosseini, <strong>N. Asadizanjani<\/strong>, \u201cSurvey of terahertz photonics and biophotonics\u201d, Optical Engineering, 59 (6), pages 1-32, 2020.<\/li>\n\n\n\n<li>T. Rahman , M. S. Rahman, H. Wang, S. Tajik, W. Khalil, F. Farahmandi, D. Forte, <strong>N. Asadizanjani<\/strong>, M. Tehranipoor, \u201cDefense-in-depth: a recipe for logic locking to prevail\u201d, Integration, Januray 2020.<\/li>\n\n\n\n<li>M. Rahman, <strong>N. Asadizanjani<\/strong>, &#8220;Failure Analysis For Hardware Assurance and Security&#8221;, Electronic Device Failure Analysis (EDFA), August 2019.\u00a0<\/li>\n\n\n\n<li>R. Wilson, <strong>N. Asadizanjani<\/strong>, D. Forte, D.Woodard, &#8220;First Auto-Magnifier Platform for Hardware Assurance and Reverse Engineering Integrated Circuits&#8221; <i>Microscopy and Microanalysis,<\/i>\u00a0<i>25<\/i>(S2), 226-227, 2019.\u00a0<\/li>\n\n\n\n<li>F. Ganji, D. Forte, <strong>N. Asadizanjani<\/strong>, M. Tehranipoor, D. Woodard, &#8220;The power of IC Reverse Engineering for Hardware Trust and Assurance&#8221;, Electronic Device Failure Analysis (EDFA), May 2019.\u00a0<\/li>\n\n\n\n<li>N. Vashistha, M Tanjidur Rahman, H. Shen, D. L. Woodard, <strong>N. Asadizanjani<\/strong>, and M. Tehranipoor. Detecting hardware Trojans inserted by untrusted foundry using physical inspection and advanced image processing. Journal of Hardware and Systems Security (HaSS), pages 1\u201312, 2018.<\/li>\n\n\n\n<li>E.L. Principe, <strong>N. Asadizanjani<\/strong>,\u00a0D. Forte, M. Tehranipoor, R. Chivas, M. DiBattista, S. Silverman, &#8220;Plasma FIB Deprocessing of Integrated Circuits from the Backside&#8221;, Electronic Device Failure Analysis (EDFA), Vol. 19, No. 4, November 2017.\u00a0<\/li>\n\n\n\n<li>K. Ahi, S. Shahbazmohamadi, and <strong>N. Asadizanjani<\/strong>, \u201cQuality control and authentication of packaged integrated circuits using enhanced-spatial-resolution terahertz time-domain spectroscopy and imaging\u201c,\u00a0<em>Optics and Lasers in Engineering<\/em>, 2017.<\/li>\n\n\n\n<li><strong>N. Asadizanjani<\/strong>, M. Tehranipoor, D. Forte, \u201cCounterfeit Electronics Detection Using Image Processing and Machine Learning\u201d, <em>Journal of Physics: Conference Series<\/em>. Vol. 787. No. 1. IOP Publishing, 2017.<\/li>\n\n\n\n<li>M<strong>. <\/strong>Alam, <strong>N. Asadizanjani<\/strong>, M. Tehranipoor,\u00a0D. Forte, &#8220;Impact of X-ray Tomography on the Reliability of Integrated Circuits&#8221;, IEEE Transactions on Device and Materials Reliability (TDMR), 17(1), pp.59-68, 2017.<\/li>\n\n\n\n<li><strong>N. Asadizanjani<\/strong>, M. Tehranipoor, D. Forte, \u201cPCB Reverse Engineering Using Non-destructive X-ray Tomography and Advanced Image Processing\u201d, Transactions on Components, Packaging and Manufacturing Technology (TCPMT), <em>7<\/em>(2), pp.292-299, 2017.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S. Shahbazmohamadi , E.H. Jordan, \u201cOptimization and development of X-ray Microscopy Technique for investigation of Thermal Barrier Coating\u201d, Processing and Properties of Advanced Ceramics and Composites VII: Ceramic Transactions, Vol. 252, pp. 425-440, 2015.<\/li>\n\n\n\n<li>S. E. Quadir, J.Chen, D.Forte, <strong>N. Asadizanjani,<\/strong> S. Shahbazmohamadi, L. Wang, J. Chandy, M. Tehranipoor, \u201cA survey on chip to system reverse engineering\u201d ACM journal on emerging technologies in computing systems (JETC), 13(1), p.6., 2015.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S. Shahbazmohamadi, E.H. Jordan, \u201cInvestigation of Surface Geometry Change in Thermal Barrier Coatings Using Computed X-ray Tomography\u201d, Developments in Strategic Materials and Computational Design V: Ceramic Engineering and Science Proceedings, Volume 358, 2015.<\/li>\n\n\n\n<li>S. Zanganeh, S. Zanganeh, Rajabi, M. Allahkarami, R.G. Ghahnavyeh, A. Moghaddas, M. Aieneravaie, <strong>N.<\/strong> <strong>Asadizanjani<\/strong>, and S.K. Sadrnezhaad. &#8220;Flower-like boehmite nanostructure formation in two-steps.&#8221;Journal of Coordination Chemistry, Vol.\u00a067, No. 3 pp. 555-562, 2014.<\/li>\n\n\n\n<li><strong> N. Asadizanjani, <\/strong>Z. Fan, R.X. Gao, and D.O. Kazmer, &#8220;Acoustic Wave-Based Data Transmission for Multivariate Sensing.&#8221; IEEE Transactions on Instrumentation and Measurement, Vol. 62, No. 11, pp. 3026-3034, 2013.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, R.X. Gao, Z. Fan, and D.O. Kazmer, &#8220;Acoustic-based wireless signal transmission for precision metrology: Accuracy and reliability.&#8221;CIRP Annals-Manufacturing Technology\u00a0Vol. 62, No. 1, pp. 519-522, 2013.<\/li>\n<\/ul>\n\n\n\n<p><u>Peer Reviewed Conference papers <\/u><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>O. P. Paradis, D. E. Capecci, N. T. Jessurun, D. L. Woodard, M. Tehranipoor, <strong>N. Asadizanjani<\/strong>, \u201cFramework for Automatic PCB Marking Detection and Recognition for Hardware Assurance\u201d, GOMACtech, March 2021.<\/li>\n\n\n\n<li>U. Botero, F. Ganji, <strong>N. Asadizanjani<\/strong>, D.Woodard, D. Forte, \u201cSemi-Supervised Automated Layer Identification of X-ray Tomography Imaged PCBs\u201d, IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), December 2020.<\/li>\n\n\n\n<li>N. Jessurun, O. P. Paradis, M. Tehranipoor, and <strong>N. Asadizanjani<\/strong> \u201cSHADE: Automated Refinement of PCB Component Estimates Using Detected Shadows\u201d, IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), December 2020.\u00a0(<strong>Best student presentation award<\/strong>)<\/li>\n\n\n\n<li>M.T. Rahman, S. Tajik, M.S. Rahman, M. Tehranipoor, and <strong>N. Asadizanjani<\/strong>\u00a0\u201cThe Key is Left under the Mat: On the Inappropriate Security Assumption of Logic Locking Schemes\u201d, IEEE International Symposium on Hardware-Oriented Security and Trust (HOST), December 2020.<\/li>\n\n\n\n<li>H. Lu, R. Wilson, N. Vashistha, <strong>N. Asadizanjani<\/strong>, M. Tehranipoor, and D. Woodard, \u201cKnowledge-based Object Localization in Scanning Electron Microscopy Images for Hardware Assurance\u201d, International Symposium for Testing and Failure Analysis (ISTFA), November 2020.<\/li>\n\n\n\n<li>A. Roberts, J. True, N. Jessurun and <strong>N. Asadizanjani<\/strong>, \u201cAn Overview of 3D X-ray Reconstruction Algorithms for PCB Inspection\u201d, International Symposium for Testing and Failure Analysis (ISTFA), November 2020.<\/li>\n\n\n\n<li>O. P. Paradis, N. Jessurun, M. Tehranipoor, and <strong>N. Asadizanjani<\/strong>, \u201cColor Normalization for Robust Automatic Bill of Materials Generation and Visual Inspection of PCBs\u201d, International Symposium for Testing and Failure Analysis (ISTFA), November 2020.<\/li>\n\n\n\n<li>UJ Botero, D. Koblah, DE Capecci, F. Ganji, <strong>N. Asadizanjani<\/strong>, DL Woodard, D. Forte, \u201cAutomated Via Detection for PCB Reverse Engineering\u201d, International Symposium for Testing and Failure Analysis (ISTFA), November 2020.\u00a0(<strong>Outstanding Paper Award<\/strong>)<\/li>\n\n\n\n<li>R. Wilson, D. Forte, <strong>N. Asadizanjani<\/strong>, D. Woodard, \u201cLASRE: A Novel Approach to Large area Accelerated Segmentation for Reverse Engineering on SEM images\u201d, to appear International Symposium for Testing and Failure Analysis (ISTFA), November 2020.<\/li>\n\n\n\n<li>L. Lavdas, M. Rahman, M. Tehranipoor, and <strong>N. Asadizanjani<\/strong> &#8220;On Optical Attacks Making Logic Obfuscation Fragile&#8221;, IEEE International Test Conference\u00a0 (ITC) Asia, September 2020.\u00a0<\/li>\n\n\n\n<li>O.P. Paradis, N. Varshney, M.T. Rahman, M. Strizich, H. Shen, and <strong>N. Asadizanjani<\/strong>, \u201cIn-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance\u201d, GOMACtech, March 2020.<\/li>\n\n\n\n<li>A. Jain, M. Rahman, <strong>N. Asadizanjani, <\/strong>and U. Guin, Special Session: Novel Attacks on Logic-Locking, IEEE VLSI Test Symposium, San Diego, CA, 2020.<\/li>\n\n\n\n<li>M. Rahman, <strong>N. Asadizanjani,<\/strong> Backside Security Assessment of Modern SoCs, IEEE MTV Conference, Austin, TX, 2019.<\/li>\n\n\n\n<li>N. Vashistha, M. Rahman, O. Paradis, <strong>N. Asadizanjani, <\/strong>Is Backside the New Backdoor in Modern SoCs?, International Test Conference (ITC), Washington, D.C., 2019.<\/li>\n\n\n\n<li>R. Wilson, <strong>N. Asadizanjani<\/strong>, D. Forte, D. Woodard, &#8220;First Auto-Magnifier Platform for Hardware Assurance and Reverse Engineering Integrated Circuits&#8221;, Microscopy &amp; Microanalysis (M&amp;M), August 2019.<\/li>\n\n\n\n<li>Q. Shi, N. Vashista, H. Lu, H. Shi, D. Woodard, B. Tehranipoor, <strong>N. Asadizanjani<\/strong>, &#8220;Golden Gates: A New Hybrid Approach for Rapid Hardware Trojan Detection using Testing and Imaging&#8221;, Hardware-Oriented Security and Trust (HOST) May 2019.\u00a0(<strong>Best paper<\/strong>\u00a0<b>candidate to be presented at CHES 2019<\/b>)<\/li>\n\n\n\n<li>C. Eakins, Y. Helal, D. S. Smith, <strong>N. Asadizanjani,<\/strong> R. Ott, &#8220;Second Order Signature Analysis of Focused Ion Beam Modified Integrated Circuits&#8221;, GOMACtech, March 2019.<\/li>\n\n\n\n<li>Q. Shi, H. Wang, <strong>N. Asadizanjani<\/strong>, M. Tehranipoor, and D. Forte, A Comprehensive Analysis on Vulnerability of Active Shields to Tilted Microprobing Attacks.\u00a0IEEE Asian Hardware-Oriented Security and Trust (AsianHOST), 2018.<\/li>\n\n\n\n<li>T. Rahman, Q. Shi, S. Tajik, H. Shen, D. Woodard, M. Tehranipoor, &amp; N. <strong>Asadizanjani, <\/strong>(2018, July). Physical Inspection &amp; Attacks: New Frontier in Hardware Security. In\u00a0<em>2018 IEEE 3rd International Verification and Security Workshop (IVSW)<\/em>(pp. 93-102).<\/li>\n\n\n\n<li>H. Shen, M. T. Rahman, <strong>N. Asadizanjani<\/strong>, M. Tehranipoor, S. Bhunia,\u00a0Coating-based PCB Protection against Tampering, Snooping, EM Attack, and X-ray Reverse Engineering,\u00a0International Symposium for Testing and Failure Analysis (ISTFA), Phoenix, NV, 2018.<\/li>\n\n\n\n<li>N. Vashistha, H. Lu, Q. Shi, M. Rahman, H. Shen, D. Woodard, <strong>N. Asadizanjani,<\/strong> and M. Tehranipoor, Trojan Scanner: Detecting Hardware Trojans with Rapid Imaging Combined with Image Processing and Machine Learning, International Symposium for Testing and Failure Analysis (ISTFA), Phoenix, NV, 2018. <a href=\"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-content\/uploads\/sites\/769\/2019\/01\/ISTFA-2018-Trojan-Scanner-Detecting-Hardware-Trojans-by-Nidish-Vashistha-at-et.-al-Univeristy-of-Florida.pdf\">link<\/a><\/li>\n\n\n\n<li>H. Shen, <strong>N. Asadizanjani,<\/strong> M. Tehranipoor, and D. Forte, Nanopyramid An optical scrambler against backside probing attacks, International Symposium for Testing and Failure Analysis (ISTFA), Phoenix, NV, 2018.<\/li>\n\n\n\n<li>Nidish Vashistha, M Tanjidur Rahman, Haoting Shen, Damon L Woodard, <strong>Navid Asadizanjani<\/strong>, and Mark Tehranipoor. Detecting hardware Trojans inserted by untrusted foundry using physical inspection and advanced image processing. PAINE 2018, workshop digest.<\/li>\n\n\n\n<li>E.L. Principe, <strong>N. Asadizanjani<\/strong>,\u00a0D. Forte,\u00a0M. Tehranipoor, M. DiBattista, R. Chivas, S. Silverman, N. Piche, M. Marsh, J. Mastovich, &#8220;Steps Toward Computational Guided Deprocessing of Integrated Circuits&#8221; in GOMACTech, March 2018.<\/li>\n\n\n\n<li>S. Baireddy, U.J. Botero, <strong>N. Asadizanjani,<\/strong> M.Tehranipoor, D. Woodard,\u00a0D. Forte, &#8220;Automated Detection of Counterfeit IC Defects Using Image Processing&#8221; in GOMACTech, March 2018.<\/li>\n\n\n\n<li>E.L. Principe, <strong>N.Asadizanjani,<\/strong>\u00a0D. Forte, M. Tehranipoor, R. Chivas, M. DiBattista, S.Silverman, M. Marsh, N. Piche, J. Mastovich, &#8220;Steps Toward Automated Deprocessing of Integrated Circuits,&#8221;\u00a0 International Symposium for Testing and Failure Analysis (ISTFA), Nov. 2017. (<strong>Outstanding Paper Award<\/strong>)<\/li>\n\n\n\n<li>Q. Shi, <strong>N. Asadizanjani<\/strong>,D. Forte, M. Tehranipoor, &#8220;Layout-based Microprobing Vulnerability Assessment for Security Critical Applications,&#8221; in GOMACTech, March 2017.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S. Gattigowda,\u00a0 N. Dunn, M. Tehranipoor, D. Forte, \u201c<a href=\"https:\/\/scholar.google.com\/citations?view_op=view_citation&amp;hl=en&amp;user=xsHD2SgAAAAJ&amp;sortby=pubdate&amp;citation_for_view=xsHD2SgAAAAJ:Zph67rFs4hoC\">A Database for Counterfeit Electronics and Automatic Defect Detection Based on Image processing and Machine Learning<\/a>\u201d, International Symposium for Testing and Failure Analysis (ISTFA), Fort worth, TX, 2016.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, D. Forte, M. Tehranipoor, \u201cNon-destructive Bond Pull and Ball Shear Failure Analysis Based on Real Structural Properties\u201d, International Symposium for Testing and Failure Analysis (ISTFA), Fort Worth, TX, 2016.<\/li>\n\n\n\n<li>Z. Guo<strong>, <\/strong>B. Shakya, H. Chen, S. Bhunia, <strong>N. Asadizanjani<\/strong>, D. Forte, M. Tehranipoor, \u201cA New Methodology to Protect PCBs from Non-destructive Reverse Engineering\u201d, International Symposium for Testing and Failure Analysis (ISTFA), Fort Worth, TX, 2016.<\/li>\n\n\n\n<li>B. Shakya, <strong>N. Asadizanjani<\/strong>,\u00a0D. Forte, M. Tehranipoor, &#8220;Chip Editor: Leveraging Circuit Edit for Logic Obfuscation and Trusted Fabrication,&#8221; IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 2016.<\/li>\n\n\n\n<li>Q. Shi, <strong>N. Asadizanjani<\/strong>, D. Forte, M. Tehranipoor, &#8220;A Layout-driven Framework to Assess Vulnerability of ICs to Microprobing Attacks&#8221;, Hardware-Oriented Security and Trust (HOST) 2016, May 2016. (<strong>Best paper<\/strong> <strong>awarded<\/strong>)<\/li>\n\n\n\n<li>S. Shahbazmohamadi,<strong>N.<\/strong> <strong>Asadizanjani<\/strong>, D. Forte, M. Tehranipoor, &#8220;Nondestructive X-ray Tomography Based Bond Pull and Ball Shear Analysis&#8221; in GOMACTech, March 2016.<\/li>\n\n\n\n<li>M M<strong>. <\/strong>Alam, <strong>N. Asadizanjani<\/strong>, M. Tehranipoor,\u00a0D. Forte, &#8220;The Impact of X-ray Tomography on the Reliability of FPGAs&#8221; in GOMACTech, March 2016.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S. Shahbazmohamadi, M. Tehranipoor, D. Forte, \u201c<a href=\"https:\/\/asm.confex.com\/asm\/istfa15\/webprogram\/Paper41008.html\">Non-destructive PCB Reverse Engineering Using X-ray Micro Computed Tomography<\/a>\u201d, International Symposium for Testing and Failure Analysis (ISTFA), Portland, OR, 2015.<\/li>\n\n\n\n<li>H. Dogan, M. Alam,<strong> N. Asadizanjani<\/strong>, S. Shahbazmohamadi, D. Forte, M. Tehranipoor, \u201c<a href=\"https:\/\/scholar.google.com\/citations?view_op=view_citation&amp;hl=en&amp;user=xsHD2SgAAAAJ&amp;sortby=pubdate&amp;citation_for_view=xsHD2SgAAAAJ:W7OEmFMy1HYC\">Analyzing the Impact of X-ray Tomography for Non-destructive Counterfeit Detection<\/a>\u201d, International Symposium for Testing and Failure Analysis (ISTFA), Portland, OR, 2015.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S.E. Quadir, S. Shahbazmohamadi, M. Tehranipoor, D. Forte, \u201cRapid Non-destructive Reverse Engineering of Printed Circuit Boards by High Resolution X-ray Tomography\u201d, Government Microcircuit applications &amp; Critical Technology Conference (GOMACTech), St. Louis, MO, 2015.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S. Shahbazmohamadi, E.H. Jordan, \u201cX-ray Tomography Imaging of APS TBC Damage Progression\u201d, 39<sup>th<\/sup> Int\u2019l Conf &amp; Expo on Advanced Ceramics &amp; Composites (ICACC 2015) proceedings, Daytona beach, January, 2015.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S. Shahbazmohamadi, E.H. Jordan, \u201cInvestigation of Surface Geometry Change in Thermal Barrier Coatings Using Computed X-ray Tomography\u201d, 38<sup>th<\/sup> Int\u2019l Conf &amp; Expo on Advanced Ceramics &amp; Composites (ICACC 2014) proceedings, Daytona beach, January, 2014.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S. Shahbazmohamadi, E.H. Jordan, \u201cInvestigation of Cracks Behavior Correlatred with Interface Geometry in TBC Systems Using 3D Non-Destructive Imaging\u201d, Material Science &amp; Technology, Pittsburgh, 2014.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, S. Shahbazmohamadi, E.H. Jordan, \u201cNon-destructive 3D Investigation of Cracks Evolution in thermal Barrier Coatings\u201d, Amira-Avizo User Group Meeting 2014, Boston, October 2014.<\/li>\n\n\n\n<li>S. Shahbazmohamadi , <strong>N. Asadizanjani, <\/strong>, E.H. Jordan, \u201cStatistical Analysis of Evolution of Rumpling in Thermal Barrier Coatings Using Advanced 3D Imaging Techniques\u201d Materials Science and Technology (MS&amp;T), Quebec, Canada, October, 2013.<\/li>\n\n\n\n<li>M.K. Fisches, D.O. Kazmer, R.X. Gao, G.W. Gordon, Z. Fan, <strong>N. Asadizanjani<\/strong>, \u201cVerification of rheological mixing rules to the application of masterbatches\u201d, Annual Technical Conference &#8211; ANTEC, Conference Proceedings, 2, pp. 1073-1078, 2013.<\/li>\n\n\n\n<li>G.W. Gordon, D.O. Kazmer, R.X. Gao, Z. Fan, <strong>N.<\/strong> <strong>Asadizanjani, <\/strong>\u201cTemperature modeling for a multivariate injection molding sensor\u201d, Annual Technical Conference &#8211; ANTEC, Conference Proceedings, 2, pp. 1103-1110, 2013.<\/li>\n\n\n\n<li>D. O. Kazmer, S.P. Johnston, G.W. Gordon, R.X. Gao , Z. Fan,<strong> N.<\/strong> <strong>Asadizanjani<\/strong>, \u201cA multivariate in-mold sensor design for measurement of melt pressure, temperature, velocity, and viscosity\u201d, Annual Technical Conference &#8211; ANTEC, Conference Proceedings, 2, pp. 1559-1566, 2012.<\/li>\n\n\n\n<li>Z. Fan, R.X. Gao, <strong>N. Asadizanjani<\/strong>, and D.O. Kazmer, &#8220;Coded acoustic wave modulation for multi-parameter transmission.&#8221; In Instrumentation and Measurement Technology Conference (I2MTC), 2012 IEEE International, pp. 2236-2241, 2012.<\/li>\n\n\n\n<li><strong> N. Asadizanjani<\/strong>, R.X. Gao, Z. Fan, and D.O. Kazmer, &#8220;Viscosity Measurement in Injection Molding Using a Multivariate Sensor.&#8221; In ASME\/ISCIE 2012 International Symposium on Flexible Automation, pp. 231-237. American Society of Mechanical Engineers, 2012. (<strong>Best paper<\/strong> <strong>awarded<\/strong>)<\/li>\n\n\n\n<li>R. X. Gao, Z. Fan, <strong>N. Asadizanjani<\/strong>, and D.O. Kazmer, &#8220;A new method for determining melt front velocity through temperature measurement.&#8221; InASME 2011 Dynamic Systems and Control Conference and Bath\/ASME Symposium on Fluid Power and Motion Control, pp. 167-172. American Society of Mechanical Engineers, 2011.<\/li>\n<\/ul>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Google Scholar Page: link YouTube Channel: Link Repository of Physical Images: Link Books Physical Assurance Materials for Electronics Security and Assurance Introduction to Microelectronics Advanced Packaging Assurance Book Chapter Journal Publications Peer Reviewed Conference papers<\/p>\n","protected":false},"author":468,"featured_media":0,"parent":0,"menu_order":3,"comment_status":"closed","ping_status":"closed","template":"page-templates\/page-sidebar-none.php","meta":{"_acf_changed":false,"inline_featured_image":false,"featured_post":"","footnotes":"","_links_to":"","_links_to_target":""},"class_list":["post-11","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/pages\/11","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/users\/468"}],"replies":[{"embeddable":true,"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/comments?post=11"}],"version-history":[{"count":4,"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/pages\/11\/revisions"}],"predecessor-version":[{"id":1401,"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/pages\/11\/revisions\/1401"}],"wp:attachment":[{"href":"https:\/\/faculty.eng.ufl.edu\/navid-asadi\/wp-json\/wp\/v2\/media?parent=11"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}